SMIC urges China’s chipmakers to embrace advanced packaging as Moore’s Law slows nanometre node progress and US sanctions bite

Chinese chip makers should focus on developing advanced packaging technologies to overcome their weakness in nanometre process nodes, according to Chiang Shang-yi, the former TSMC R&D director recently recruited by Semiconductor Manufacturing International Corp (SMIC). Chiang, SMIC’s executive director and vice-chairman, said future breakthroughs for the country’s integrated circuit (IC) manufacturing industry would come from advanced packaging techniques that can cram more circuits into smaller