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DIGITIMES
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
DIGITIMES
Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D
DIGITIMES
Samsung HBM4E wins NVIDIA nod for AI accelerator push
DIGITIMES
Ample revenue slips in September as passive component demand stays strong
EE Times
Scaling 3D IC design: Trends, Challenges and Practical Workflows
Semiconductor Digest
Microchip Technology Acquires VORAGO Technologies
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