DIGITIMES

US signs up to US$389 million in CHIPS R&D deals for power chips and fusion

The US Department of Commerce has signed letters of intent with four companies to provide up to US$389 million in federal research and development awards under the CHIPS and Science Act, targeting the semiconductors and materials used to control, convert, and deliver power. The department announced the agreements on October 22, 2026.

By DIGITIMES

1 min read
US signs up to US$389 million in CHIPS R&D deals for power chips and fusion
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