Semiconductor Engineering

Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)

Researchers at Argonne National Laboratory and the University of Illinois Urbana-Champaign published a technical paper titled “Agentic AI for Heterogeneous System Design Across Chip, Scale-Up, and Scale-Out Domains.” Abstract Excerpt: “The design space of modern AI/HPC systems has expanded rapidly across compute architectures, including GPUs, dataflow processors, and RISC-V accelerators; memory technologies, including HBM, GDDR,... » read more The post Agentic AI Explores Heterogeneous Chip

By Semiconductor Engineering

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Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)
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