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DIGITIMES
Cisco, Nvidia target high-speed optical interconnects with 4x USFP density
Semiconductor Digest
ETEL Launches METIS HP High-Precision Motion Platform
DIGITIMES
Cisco expands AI networking with new chips, SONiC, cross-site deployment
DIGITIMES
Samsung, AMD validate CXL memory for AI servers
Semiconductor Engineering
Agentic AI Automates RTL Waveform Analysis And Debugging (Columbia, Google)
Semiconductor Digest
Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates
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