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DIGITIMES
Ample revenue slips in September as passive component demand stays strong
EE Times
Physical AI Needs a Neuromorphic Path from Sensor to Silicon
Semiconductor Engineering
Chip Industry Week In Review
EE Times
Connecting Chiplets Isn’t Enough – Solving the Data Movement Challenge in Multi-Die Systems
DIGITIMES
Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D
DIGITIMES
MediaTek 3Q26 revenue beats forecast, maintains peak-season momentum
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