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2026 6th International Conference on Electronic Materials and Information E

17 – 19 Jul 2026·China

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2026 6th International Conference on Electronic Materials and Information E

17 Jul 2026 · Harbin

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Advanced Manufacturing & MaterialsInformation & Communication Technology (ICT)

2026 6th International Conference on Electronic Materials and Information E

2026 6th International Conference on Electronic Materials and Information Engineering (EMIE 2026) will be held in Harbin, China from July 17 to 19, 20

  • Date

    17 - 19 July 2026

  • Location

    Harbin, China

  • Event Type

    Conferences & Summits

  • Delivery Format

    Hybrid (Onsite & Online)

Register Now
2026 6th International Conference on Electronic Materials and Information E logo

2026 6th International Conference on Electronic Materials and Information Engineering (EMIE 2026) will be held in Harbin, China from July 17 to 19, 2026.

 

Conference Website: https://ais.cn/u/uMFbE3

 

---Call For Papers---

The topics of interest for submission include, but are not limited to:

◕Electronic materials

Physical chemistry

Semiconductor material

Conductive metals and their alloys

Electromagnetic shielding material

Dielectric material

Piezoelectric and ferroelectric materials

Magnetic material

Optoelectronic material

Integrated circuit

 

◕Information engineering:

Electronic science and technology

Information and communication Engineering

Optoelectronic information science and technology

Engineering optics

Information optics

Electronic technology

Photoelectric technology

Communication technology

Measurement and control technology

Computer application technology

 

---Publication---

All papers, both invited and contributed, will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers of EMIE 2026 will be published in SPIE - The International Society for Optical Engineering (ISSN: 0277-786X), and indexed by EI Compendex and Scopus.

 

---Important Dates---

Submission Deadline: June 10, 2026

Registration Deadline: July 3, 2026

Final Paper Submission Date: July 10, 2026

Conference Dates: July 17-19, 2026

 

--- Paper Submission---

Please send the full paper(word+pdf) to Submission System:

https://ais.cn/u/uMFbE3

Pricing & Registration

Attendance Fee

$100-500

USD per attendee

Register Now

Pricing & Registration

Attendance Fee

$100-500

USD per attendee

Register Now

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Visit Event Website

Event Location & Venue

Join us at this world-class venue designed to inspire meaningful connections.

Venue

Location

Harbin

Harbin, China

Date & Time

17 - 19 July 2026

Timezone

GMT+8 (Shanghai)

Get Directions
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