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  3. ACCM Expands US Manufacturing Capacity Across Four Advanced Materials Segments for AI Infrastructure

Semiconductor Digest

ACCM Expands US Manufacturing Capacity Across Four Advanced Materials Segments for AI Infrastructure

ACCM's Wisconsin facility will bring online laminate capacity of 20 million square feet per year in January 2027, with build-up and prepreg capacity of 87 million square feet per year online in November 2026. The post ACCM Expands US Manufacturing Capacity Across Four Advanced Materials Segments for AI Infrastructure appeared first on Semiconductor Digest.

Continue with the complete report on the publisher’s website.

Read full article at Semiconductor Digest
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By Semiconductor Digest

24 September 2026|1 min read
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