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DIGITIMES
iPhone 18 Pro preorders rise up to 20% in Taiwan as foldable Duo debuts
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Samsung expands SRAM, IP to speed chip development
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Foxconn links FII and FIT to tackle AI infrastructure beyond the chip
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20 of China's OSATs push into advanced packaging amid EUV curbs
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Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades
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Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects
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