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Foxconn links FII and FIT to tackle AI infrastructure beyond the chip
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FIT ramps up optical interconnect push as AI race shifts to connectivity
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Taiwan readies ETS pilot as overseas expansion drives demand
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Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
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Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag
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Huawei sees AI agents driving 90% of token traffic by 2035
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