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DIGITIMES
Foxconn links FII and FIT to tackle AI infrastructure beyond the chip
DIGITIMES
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
DIGITIMES
Samsung reportedly starts Tesla chip trial production at Taylor fab
DIGITIMES
Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
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Taiwan machine tool makers target aerospace, semiconductor boom at major trade shows
DIGITIMES
Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects
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