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EE Times
Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing
DIGITIMES
Interview: How AI forecasting and energy scheduling are raising the bar for green power sellers
Semiconductor Digest
GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components
DIGITIMES
Ample revenue slips in September as passive component demand stays strong
EE Times
NVIDIA Jetson to SiMa.ai Modalix MLSoC Migration Guide
DIGITIMES
Advantech tops US$1 billion in third-quarter revenue as edge AI orders climb
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