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Semiconductor Engineering
Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)
Semiconductor Engineering
AI in Chip Design: From Code Generation to EDA Orchestration (University of Edinburgh)

DIGITIMES
Power grids can't keep pace with AI data center boom in EU, US

DIGITIMES
Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease

DIGITIMES
BYD plans four Europe factories as EU tariff pressure rises

DIGITIMES
Wiwynn brings cobots to L10 server assembly as AI rack testing drives factory redesign
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