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DIGITIMES
Cisco, Nvidia target high-speed optical interconnects with 4x USFP density
DIGITIMES
AI chip competition shifts to data-center efficiency as memory, interconnect limits bite
DIGITIMES
Broadcom executive says chipmakers must tackle packaging, power limits together
EE Times
Amperesand Aims to Smooth AI Data Center Power Spikes
Semiconductor Digest
Fujifilm to Expand CMP Slurry Production Capacity in the U.S.
DIGITIMES
TSMC and MediaTek alumni lead Taiwan's new wave of deep tech startups
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