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  3. TSMC and ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung

DIGITIMES

TSMC and ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung

Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park in Kaohsiung, where construction has formally begun on what is billed as Taiwan's first advanced packaging supply-chain cluster. Led by TSMC, the park's first phase has already been fully allocated, and a groundbreaking ceremony on September 21 drew more than 20 semiconductor companies, including TSMC, Foxconn, and AS

Continue with the complete report on the publisher’s website.

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By DIGITIMES

22 September 2026|1 min read
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Semiconductors & Microelectronics
TSMC and ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung
TSMC and ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung
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