Semiconductor Engineering

3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB)

Researchers at imec and Vrije Universiteit Brussels published “Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI.” Abstract “GPU compute resources are scaling to support growing AI workloads, leading to further rises in the climate change impact of hyperscale data centers that rely on high-performance GPUs. To model how packaging decisions... » read more The post 3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB) appeared first on

By Semiconductor Engineering

1 min read
3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB)
AI-generated illustration

Got news to share with the events industry?

Submit a press release or story tip and reach thousands of event professionals.

Get in touch→

More in Semiconductors & Microelectronics

Related Insights