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EE Times
Can Jensen Keep His Job?
Semiconductor Digest
Mixx Technologies Backs Open Standards for Near-Package Optical Connectivity
Semiconductor Digest
Fraunhofer IPMS Highlights Semiconductor Technology Developments at SEMICON Europa
DIGITIMES
Taiwan's GIS targets 800G/1.6T AI optics, with laser packaging ramp-up starting 4Q26
Semiconductor Digest
Infineon Processes Functional Power Devices on 300mm SiC Wafers
DIGITIMES
SK Hynix-backed Trinity Fab to test chipmaking tools in 2027
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