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DIGITIMES
Taiwan's GIS targets 800G/1.6T AI optics, with laser packaging ramp-up starting 4Q26
DIGITIMES
SK Hynix-backed Trinity Fab to test chipmaking tools in 2027
DIGITIMES
Jensen Huang drawn into spy allegations as China rejects claims
EE Times
GigaDevice New-Gen High-Performance MCU Portfolio for Full-Scenario Industrial Applications
Semiconductor Digest
SCHMID to Supply Equipment for Advanced Packaging Facility in South Asia
DIGITIMES
Wistron ITS eyes 2027 growth driven by semiconductors and gaming
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