Semiconductor Digest

Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography

Plasma dicing offers clear advantages over saw and laser singulation for thin wafers, hybrid bonding and HBM: throughput that doesn’t depend on die count, dicing streets as narrow as 5 µm and less mechanical stress. But bumps, copper pillars and cavities make it hard to protect the die surface during plasma etching, and conventional spin coating struggles to cover that topography. The post Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography appeared first

By Semiconductor Digest

1 min read
Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography
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