Semiconductor Digest

VON ARDENNE Scales HiPIMS Sputtering from Wafers to Panels

Inline, Lego-like deposition platforms honed in glass and solar target through-glass vias and an eventual shift to optical interposers The post VON ARDENNE Scales HiPIMS Sputtering from Wafers to Panels appeared first on Semiconductor Digest.

By Semiconductor Digest

1 min read
VON ARDENNE Scales HiPIMS Sputtering from Wafers to Panels
AI-generated illustration

Got news to share with the events industry?

Submit a press release or story tip and reach thousands of event professionals.

Get in touch→

More in Semiconductors & Microelectronics

Related Insights