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  3. Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)

Semiconductor Engineering

Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)

Researchers at Peking University published a technical paper titled “Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements.” Abstract Excerpt: “The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware thermal conductivity (κ) modeling framework. However, generalizable... » read more The post Predicting

Continue with the complete report on the publisher’s website.

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By Semiconductor Engineering

19 September 2026|1 min read
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