DIGITIMES

Taiwan's GIS targets 800G/1.6T AI optics, with laser packaging ramp-up starting 4Q26

GIS is shifting from touch displays to semiconductor optics, with laser packaging entering small-volume production in the fourth quarter of 2026 and full capacity expected by the second or third quarter of 2027. Chairman Hsien-ying Chou said production lines have been installed progressively since the second quarter, supported by incoming equipment and customer-supplied materials. Passive optical components and Micro LED applications are also part of the company's expansion.

By DIGITIMES

1 min read
Taiwan's GIS targets 800G/1.6T AI optics, with laser packaging ramp-up starting 4Q26
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