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DIGITIMES
South Korea aims to speed up chip fab openings by two years

Semiconductor Digest
Laser Slicing of Large-Area Diamond Substrates

Semiconductor Engineering
Hardware Defense Blocks Memory-Dependent Prefetcher Leakage (KU Leuven)

Semiconductor Engineering
AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)

DIGITIMES
Gemtek joins three optical standards groups for AI data center development

DIGITIMES
Apple says 2nm transition is easing its advanced-node chip constraints
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