Semiconductor Digest

From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing

High-power impulse magnetron sputtering (HiPIMS) produces denser, better-adhering films than conventional sputtering, but scaling it to 200mm-plus substrates and inline production takes more than turning up the power. Authors from VON ARDENNE describe the engineering investment needed to move the technique from the lab into high-volume manufacturing. The post From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing appeared first on Semiconductor Digest.

By Semiconductor Digest

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From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing
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