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  3. Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)

Semiconductor Engineering

Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)

Researchers at the University of Technology Sydney, ShanghaiTech University, and Technical University of Munich published a technical paper titled “IC-ThermBench: An Open, Progressive Benchmark for Generalizable 2.5D/3D-IC Thermal Learning.” Abstract Excerpt: “We introduce IC-ThermBench, an open and progressive benchmark that combines established 3D-IC steady-state, transient, and industrial package tasks with a new 50,000-sample 2.5D chiplet... » read more The post Open Benchmark Evaluates

Continue with the complete report on the publisher’s website.

Read full article at Semiconductor Engineering
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By Semiconductor Engineering

19 September 2026|1 min read
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